JPH046159Y2 - - Google Patents
Info
- Publication number
- JPH046159Y2 JPH046159Y2 JP769388U JP769388U JPH046159Y2 JP H046159 Y2 JPH046159 Y2 JP H046159Y2 JP 769388 U JP769388 U JP 769388U JP 769388 U JP769388 U JP 769388U JP H046159 Y2 JPH046159 Y2 JP H046159Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cover tape
- electronic components
- type electronic
- complex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 23
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- KXAVXNWSOPHOON-UHFFFAOYSA-N 1-butylisoquinoline Chemical compound C1=CC=C2C(CCCC)=NC=CC2=C1 KXAVXNWSOPHOON-UHFFFAOYSA-N 0.000 claims description 3
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RTQPKEOYPPMVGQ-UHFFFAOYSA-N 1-methylquinolin-1-ium Chemical compound C1=CC=C2[N+](C)=CC=CC2=C1 RTQPKEOYPPMVGQ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Elimination Of Static Electricity (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP769388U JPH046159Y2 (en]) | 1988-01-26 | 1988-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP769388U JPH046159Y2 (en]) | 1988-01-26 | 1988-01-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01112599U JPH01112599U (en]) | 1989-07-28 |
| JPH046159Y2 true JPH046159Y2 (en]) | 1992-02-20 |
Family
ID=31212919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP769388U Expired JPH046159Y2 (en]) | 1988-01-26 | 1988-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046159Y2 (en]) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718619Y2 (ja) * | 1989-06-02 | 1995-05-01 | 信越ポリマー株式会社 | トップテープフィルム |
| DE69109756T3 (de) * | 1990-02-06 | 1998-10-15 | Sumitomo Bakelite Co | Trägerband aus plastik und abdeckband für elektronische chips. |
| JPH0665181B2 (ja) * | 1990-05-31 | 1994-08-22 | 信越ポリマー株式会社 | トップテープフィルム |
| JP2609779B2 (ja) * | 1991-02-28 | 1997-05-14 | 住友ベークライト株式会社 | チップ型電子部品包装用カバーテープ |
| JP2554840Y2 (ja) * | 1992-05-25 | 1997-11-19 | アキレス株式会社 | 電子部品包装用導電性キャリアテープ |
-
1988
- 1988-01-26 JP JP769388U patent/JPH046159Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01112599U (en]) | 1989-07-28 |
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